Invention Grant
- Patent Title: Component supplying apparatus and component supplying method
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Application No.: US15206811Application Date: 2016-07-11
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Publication No.: US09743570B2Publication Date: 2017-08-22
- Inventor: Minoru Kitani , Kazunori Kanai , Kazuo Kido , Seikou Abe
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wnederoth, Lind & Ponack, L.L.P.
- Priority: JP2013-027385 20130215
- Main IPC: H05K13/02
- IPC: H05K13/02 ; B32B43/00 ; H05K13/04

Abstract:
A component supplying apparatus includes a main tape entering port, a component supply port through which components are picked up from a carrier tape, a main tape path extending in a body part from the main tape entering port to the underside of the component supply port, a top tape removing part removing the top tape from the carrier tape on the main tape path upstream of the component supply port, a sub tape entering port, a sub tape path meeting a slope path portion of the main tape path at a meeting point upstream of the top tape removing part, and at least one sprocket wheels engaging with the carrier tape on the main tape path downstream of the meeting point. A length of the sub tape path is shorter than a length of the main tape path from the main tape entering port to the meeting point.
Public/Granted literature
- US20160324043A1 COMPONENT SUPPLYING APPARATUS AND COMPONENT SUPPLYING METHOD Public/Granted day:2016-11-03
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