- 专利标题: Resin composition, resin sheet, cured resin sheet, resin sheet structure, cured resin sheet structure, method for producing cured resin sheet structure, semiconductor device, and LED device
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申请号: US14392191申请日: 2014-06-26
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公开(公告)号: US09745411B2公开(公告)日: 2017-08-29
- 发明人: Tomoo Nishiyama , Shigemitsu Yoshie , Naoki Hara , Kazumasa Fukuda , Atsushi Kuwano , Yasuo Miyazaki
- 申请人: HITACHI CHEMICAL COMPANY, LTD.
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Fitch, Even, Tabin & Flannery, LLP
- 优先权: JP2013-134992 20130627
- 国际申请: PCT/JP2014/067055 WO 20140626
- 国际公布: WO2014/208694 WO 20141231
- 主分类号: C08G59/62
- IPC分类号: C08G59/62 ; C08L63/00 ; H01L23/29 ; C08L63/04 ; B32B15/092 ; B32B27/08 ; B32B27/38 ; B32B37/06 ; C08J5/18 ; H01L33/56 ; C08K3/22 ; C08K3/38
摘要:
A resin composition including an epoxy resin monomer, a novolac resin including a compound having a structural unit represented by Formula (I), and a filler; in which the filler has at least 4 peaks in a particle size distribution measured by laser diffractometry, in which four of the peaks are present respectively in ranges of not less than 0.01 μm and less than 1 μm, not less than 1 μm and less than 10 μm, from 10 μm to 50 μm, and from 20 μm to 100 μm, and in which a peak present in a range of from 10 μm to 50 μm includes an aluminum oxide particle, and a peak present in a range of from 20 μm to 100 μm includes a boron nitride particle. In Formula (I) each of R1, R2 and R3 independently represents a hydrogen atom, an alkyl group, or the like. m represents 0 to 2, and n represents 1 to 7.
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