- 专利标题: Continuous substrate processing system
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申请号: US13755891申请日: 2013-01-31
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公开(公告)号: US09748125B2公开(公告)日: 2017-08-29
- 发明人: Banqiu Wu , Nag B. Patibandla , Toshiaki Fujita , Ralf Hofmann , Pravin K. Narwankar , Jeonghoon Oh , Srinivas Satya , Li-Qun Xia
- 申请人: Banqiu Wu , Nag B. Patibandla , Toshiaki Fujita , Ralf Hofmann , Pravin K. Narwankar , Jeonghoon Oh , Srinivas Satya , Li-Qun Xia
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Servilla Whitney LLC
- 主分类号: C23C16/00
- IPC分类号: C23C16/00 ; H01L21/00 ; H01L21/673 ; H01L21/677 ; C23C16/455 ; C23C16/458 ; C23C16/54
摘要:
A processing chamber having a plurality of movable substrate carriers stacked therein for continuously processing a plurality of substrates is provided. The movable substrate carrier is capable of being transported from outside of the processing chamber, e.g., being transferred from a load luck chamber, into the processing chamber and out of the processing chamber, e.g., being transferred into another load luck chamber. Process gases delivered into the processing chamber are spatially separated into a plurality of processing slots, and/or temporally controlled. The processing chamber can be part of a multi-chamber substrate processing system.
公开/授权文献
- US20130192524A1 Continuous Substrate Processing System 公开/授权日:2013-08-01
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