Invention Grant
- Patent Title: High density capacitor structure and method
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Application No.: US14692881Application Date: 2015-04-22
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Publication No.: US09755013B2Publication Date: 2017-09-05
- Inventor: Wai-Kin Li , Chengwen Pei , Ping-Chuan Wang
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L27/06 ; H01L21/8238

Abstract:
High density capacitor structures based on an array of semiconductor nanorods are provided. The high density capacitor structure can be a plurality of capacitors in which each of the semiconductor nanorods serves as a bottom electrode for one of the plurality of capacitors, or a large-area metal-insulator-metal (MIM) capacitor in which the semiconductor nanorods serve as a support structure for a bottom electrode of the MIM capacitor subsequently formed.
Public/Granted literature
- US20160315138A1 HIGH DENSITY CAPACITOR STRUCTURE AND METHOD Public/Granted day:2016-10-27
Information query
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