Invention Grant
- Patent Title: Encapsulated microelectromechanical structure
-
Application No.: US15242437Application Date: 2016-08-19
-
Publication No.: US09758371B2Publication Date: 2017-09-12
- Inventor: Aaron Partridge , Markus Lutz , Pavan Gupta
- Applicant: SiTime Corporation
- Applicant Address: US CA Santa Clara
- Assignee: SiTime Corporation
- Current Assignee: SiTime Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Charles Shemwell
- Main IPC: H01L23/051
- IPC: H01L23/051 ; B81C1/00 ; B81B7/00 ; H01L41/113
Abstract:
A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.
Public/Granted literature
- US20170101310A1 ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE Public/Granted day:2017-04-13
Information query
IPC分类:
