Invention Grant
- Patent Title: Sacrificial cover layers for laser drilling substrates and methods thereof
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Application No.: US14092536Application Date: 2013-11-27
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Publication No.: US09758876B2Publication Date: 2017-09-12
- Inventor: Aric Bruce Shorey , Garrett Andrew Piech , Xinghua Li , John Christopher Thomas , John Tyler Keech , Jeffrey John Domey , Paul John Shustack
- Applicant: Corning Incorporated
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- Agent John T. Haran
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; B23P15/00 ; C03C25/00 ; C23F1/00 ; B44C1/22 ; C03C15/00 ; C23F4/04 ; C03B33/10 ; H05K3/00 ; C03B33/02 ; B23K26/18 ; B23K26/0622 ; B23K26/386 ; B23K26/40 ; B23K26/382 ; B23K103/00
Abstract:
A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.
Public/Granted literature
- US20140147623A1 Sacrificial Cover Layers for Laser Drilling Substrates and Methods Thereof Public/Granted day:2014-05-29
Information query
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