Invention Grant
- Patent Title: Test board, test system including the same, and manufacturing method thereof
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Application No.: US14863703Application Date: 2015-09-24
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Publication No.: US09759741B2Publication Date: 2017-09-12
- Inventor: Sooyong Park , Yong chul Jang , Kijae Song
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0128192 20140925
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R31/28

Abstract:
Provided is a test board including a main board which is configured to be connected to a plurality of devices-under-test (DUTs) and includes a plurality of test signal paths for transmitting a plurality of test signals input from an external tester to pins of at least one of the DUTs or transmitting a test result from the DUT to the tester, and a farm board which is connected to the main board and configured to mount therein a plurality of passive elements which are configured to be connected to at least one of the pins of the DUT through at least one of the test signal paths of the main board, when a test operation is performed, thereby improving a power integrity property or a signal integrity property in the test operation.
Public/Granted literature
- US20160091531A1 TEST BOARD, TEST SYSTEM INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-03-31
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