Invention Grant
- Patent Title: Plasma processing apparatus
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Application No.: US14519688Application Date: 2014-10-21
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Publication No.: US09761418B2Publication Date: 2017-09-12
- Inventor: Masayuki Shintaku , Takashi Suzuki , Masahiko Konno , Michitaka Aita , Taizo Okada , Hideo Kato , Naoki Matsumoto
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: JP2013-219280 20131022; JP2014-008405 20140121
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306 ; H01J37/32

Abstract:
A plasma processing apparatus for exciting a processing gas by a microwave, includes a focus ring extending in an annular shape, a first tubular member being wrapped around a central axis to extend along an outer periphery of the lower electrode below the focus ring, an annular member made of a dielectric material provided between the focus ring and the first tubular member a second tubular member extending along an outer periphery of the first tubular member and a choke portion suppressing a microwave propagating through the first tubular member via the focus ring and the annular member. And the choke portion protrudes outward in a diametrical direction of the first tubular from the outer periphery of the first tubular member and extends in an annular shape along the periphery of the first tubular member, the choke portion is covered by the second tubular member.
Public/Granted literature
- US20150107773A1 PLASMA PROCESSING APPARATUS Public/Granted day:2015-04-23
Information query
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