Invention Grant
- Patent Title: Pre-package and methods of manufacturing semiconductor package and electronic device using the same
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Application No.: US15286801Application Date: 2016-10-06
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Publication No.: US09761477B2Publication Date: 2017-09-12
- Inventor: Gun-ho Chang , Un-byoung Kang , Tae-je Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongton-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongton-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2014-0161631 20141119
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/683 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L23/36 ; H01L21/768 ; H01L21/304 ; H01L23/544
Abstract:
Methods of fabricating semiconductor packages are provided. One of the methods includes forming a protection layer including metal on a first surface of a substrate to cover a semiconductor device disposed on the first surface of the substrate, attaching a support substrate to the protection layer by using an adhesive member, processing a second surface of the substrate opposite to the protection layer to remove a part of the substrate, and detaching the support substrate from the substrate.
Public/Granted literature
- US20170025302A1 PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2017-01-26
Information query
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