Invention Grant
- Patent Title: Leadframe assembly, housing assembly, module assembly and method of determining at least one value of a measurement variable of an electronic module
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Application No.: US14644268Application Date: 2015-03-11
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Publication No.: US09761512B2Publication Date: 2017-09-12
- Inventor: Stephan Preuss , Michael Zitzlsperger
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102012109159 20120927
- Main IPC: H01L23/495
- IPC: H01L23/495 ; G01R31/26 ; G01R27/02 ; H01L33/62 ; H01L21/66
Abstract:
A leadframe assembly is formed from an electrically conductive material. The leadframe assembly includes a first longitudinal element, at least one second longitudinal element, a plurality of first leadframe sections and a plurality of second leadframe sections.
Public/Granted literature
Information query
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