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公开(公告)号：US09761512B2
公开(公告)日：2017-09-12
申请号：US14644268
申请日：2015-03-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stephan Preuss , Michael Zitzlsperger
IPC: H01L23/495 , G01R31/26 , G01R27/02 , H01L33/62 , H01L21/66
CPC classification number: H01L23/49551 , G01R27/02 , G01R31/26 , H01L22/14 , H01L22/20 , H01L23/49555 , H01L23/49562 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
Abstract: A leadframe assembly is formed from an electrically conductive material. The leadframe assembly includes a first longitudinal element, at least one second longitudinal element, a plurality of first leadframe sections and a plurality of second leadframe sections.
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2.发明申请LEADFRAME ASSEMBLY, HOUSING ASSEMBLY, MODULE ASSEMBLY AND METHOD OF DETERMINING AT LEAST ONE VALUE OF A MEASUREMENT VARIABLE OF AN ELECTRONIC MODULE 有权LEADFRAME组件，住房组件，模块组件和确定电子模块可变量的最小值的一种方法公开(公告)号：US20150187685A1
公开(公告)日：2015-07-02
申请号：US14644268
申请日：2015-03-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stephan Preuss , Michael Zitzlsperger
IPC: H01L23/495 , G01R31/26 , G01R27/02
CPC classification number: H01L23/49551 , G01R27/02 , G01R31/26 , H01L22/14 , H01L22/20 , H01L23/49555 , H01L23/49562 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
Abstract: A leadframe assembly is formed from an electrically conductive material. The leadframe assembly includes a first longitudinal element, at least one second longitudinal element, a plurality of first leadframe sections and a plurality of second leadframe sections.
Abstract translation: 引线框组件由导电材料形成。 引线框架组件包括第一纵向元件，至少一个第二纵向元件，多个第一引线框架部分和多个第二引线框架部分。
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