Invention Grant
- Patent Title: Porous alumina templates for electronic packages
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Application No.: US15477265Application Date: 2017-04-03
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Publication No.: US09761517B2Publication Date: 2017-09-12
- Inventor: Rajesh Katkar , Cyprian Emeka Uzoh , Belgacem Haba , Ilyas Mohammed
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/00 ; H05K1/11 ; H01L23/498 ; H01L23/00 ; H01L25/065 ; H01L23/538 ; H01L23/373 ; H01L21/48

Abstract:
Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing surfaces and a plurality of pores, each pore extending in a first direction from the first surface towards the second surface, wherein alumina extends along a wall of each pore; a plurality of electrically conductive connection elements extending in the first direction, consisting essentially of aluminum and being electrically isolated from one another by at least the alumina; a first conductive path provided at the first surface for connection with a first component external to the interposer; and a second conductive path provided at the second surface for connection with a second component external to the interposer, wherein the first and second conductive paths are electrically connected through at least some of the connection elements.
Public/Granted literature
- US20170207159A1 POROUS ALUMINA TEMPLATES FOR ELECTRONIC PACKAGES Public/Granted day:2017-07-20
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