Invention Grant
- Patent Title: Package substrate and semiconductor package including the same
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Application No.: US15155008Application Date: 2016-05-14
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Publication No.: US09761519B2Publication Date: 2017-09-12
- Inventor: Jae-hoon Choi , Chang-yong Park , Dong-woo Shin
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2015-0085146 20150616
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/48 ; H01L23/02 ; H01L23/498
Abstract:
A package substrate includes: a body layer; and a pattern layer formed on a surface of the body layer. The pattern layer includes: a wire pattern; a solder pad connected to the wire pattern; and a through hole adjacent to a boundary between the wire pattern and the solder pad and vertically penetrating the pattern layer. A semiconductor package and an electronic device are disclosed.
Public/Granted literature
- US20160372412A1 PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Public/Granted day:2016-12-22
Information query
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