公开(公告)号：US11607638B2

公开(公告)日：2023-03-21

申请号：US16630263

申请日：2018-08-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-woo Shin ,  Sang-hoon Lee ,  Young-chul Ko ,  Hyun-joo Kim

IPC: B01D46/00 ,  B01D46/52 ,  B01D39/20 ,  B01D46/58 ,  B01D46/62

Abstract: A filter assembly is provided. The filter assembly includes a plurality of filter modules each filled with activated carbon and continuously connected; and a frame to which the plurality of filter modules are fixed, wherein the plurality of filter modules are disposed at predetermined angles relative to each other.

公开(公告)号：US20150077153A1

公开(公告)日：2015-03-19

申请号：US14465364

申请日：2014-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-woo Kim ,  Dong-woo Shin ,  IL-hyoung Koo ,  Do-young Jung

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  G01R31/28

CPC classification number: H01L21/68707 ,  G01R31/2893 ,  G11C16/00 ,  G11C29/56016 ,  H01L21/67271 ,  H01L21/67294

Abstract: An automatic module apparatus for manufacturing a solid state drive (SSD) includes a labeling apparatus, one or more test handler apparatuses and a sorting apparatus. The labeling apparatus is for printing a label on a SSD mounted on a carrier tray. The one or more test handler apparatuses are for transporting the carrier tray on which the labeled SSD is mounted and for testing the labeled SSDs to determine whether the labeled SSDs have any defects. The SSD sorting apparatus is for transporting the carrier tray on which the tested SSDs are mounted and sorting non-defective defective SSDs tested by the test handler apparatuses. The SSD labeling apparatus, the test handler apparatuses, and the SSD sorting apparatus are in-line and automated.

Abstract translation: 用于制造固态驱动器（SSD）的自动模块装置包括标签装置，一个或多个测试处理装置和分拣装置。 标签装置用于在安装在托盘上的SSD上印刷标签。 一个或多个测试处理设备用于传送其上安装有标记的SSD的载体盘，并且用于测试标记的SSD以确定标记的SSD是否具有任何缺陷。 SSD分类装置用于运送安装有测试SSD的托盘，并对由测试处理设备测试的无缺陷缺陷SSD进行排序。 SSD标签装置，测试处理装置和SSD分类装置是线上自动的。

公开(公告)号：US09711389B2

公开(公告)日：2017-07-18

申请号：US14465364

申请日：2014-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-woo Kim ,  Dong-woo Shin ,  Il-hyoung Koo ,  Do-young Jung

IPC: H01L21/67 ,  H01L21/687 ,  G01R31/28 ,  G11C29/56 ,  G11C16/00

CPC classification number: H01L21/68707 ,  G01R31/2893 ,  G11C16/00 ,  G11C29/56016 ,  H01L21/67271 ,  H01L21/67294

Abstract: An automatic module apparatus for manufacturing a solid state drive (SSD) includes a labeling apparatus, one or more test handler apparatuses and a sorting apparatus. The labeling apparatus is for printing a label on a SSD mounted on a carrier tray. The one or more test handler apparatuses are for transporting the carrier tray on which the labeled SSD is mounted and for testing the labeled SSDs to determine whether the labeled SSDs have any defects. The SSD sorting apparatus is for transporting the carrier tray on which the tested SSDs are mounted and sorting non-defective defective SSDs tested by the test handler apparatuses. The SSD labeling apparatus, the test handler apparatuses, and the SSD sorting apparatus are in-line and automated.

公开(公告)号：US09761519B2

公开(公告)日：2017-09-12

申请号：US15155008

申请日：2016-05-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-hoon Choi ,  Chang-yong Park ,  Dong-woo Shin

IPC: H01L23/12 ,  H01L23/48 ,  H01L23/02 ,  H01L23/498

CPC classification number: H01L23/49838 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A package substrate includes: a body layer; and a pattern layer formed on a surface of the body layer. The pattern layer includes: a wire pattern; a solder pad connected to the wire pattern; and a through hole adjacent to a boundary between the wire pattern and the solder pad and vertically penetrating the pattern layer. A semiconductor package and an electronic device are disclosed.