- 专利标题： Semiconductor package, semiconductor device using the same and manufacturing method thereof
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申请号： US15162760申请日： 2016-05-24
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公开(公告)号： US09761534B2公开(公告)日： 2017-09-12
- 发明人: Wen-Sung Hsu , Shih-Chin Lin , Tao Cheng , Andrew C. Chang
- 申请人： MEDIATEK Inc.
- 申请人地址： TW Hsin-Chu
- 专利权人： MEDIATEK INC.
- 当前专利权人： MEDIATEK INC.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： McClure, Qualey & Rodack, LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/538 ; H01L23/31 ; H01L25/10 ; H01L25/00 ; H01L21/48 ; H01L21/56 ; H01L23/14 ; H01L25/065 ; H01L25/16 ; H01L23/50 ; H01L23/00 ; H01L23/498
摘要：
A semiconductor package includes a package substrate, a first electronic component and a second package body. The package substrate includes a first conductive layer, a first pillar layer, a first package body and a second conductive layer, wherein the first pillar layer is formed on the first conductive layer, the first package body encapsulates the first conductive layer and the first pillar layer, and the second conductive layer electrically connects to the first pillar layer. The first electronic component is disposed above the second conductive layer of the package substrate. The second package body encapsulates the first electronic component and the second conductive layer.
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