Invention Grant
- Patent Title: Ball mounting method and working machine for board
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Application No.: US14389480Application Date: 2012-04-10
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Publication No.: US09763335B2Publication Date: 2017-09-12
- Inventor: Hiromitsu Oka , Tetsuo Hayashi
- Applicant: Hiromitsu Oka , Tetsuo Hayashi
- Applicant Address: JP Chiryu-shi
- Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee: FUJI MACHINE MFG. CO., LTD.
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2012/059769 WO 20120410
- International Announcement: WO2013/153616 WO 20131017
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K1/20 ; B23K3/00 ; H05K3/34 ; B23K3/06 ; H01L21/50

Abstract:
A working machine for a board including a working device that selectively performs work for mounting conductive balls on a circuit board by a ball holder and work for transferring viscous fluid onto the circuit board by transfer pins, and a tray in which the viscous fluid is stored, when the conductive balls are to be mounted on the circuit board, the viscous fluid being transferred onto the circuit board by the transfer pins and the conductive balls having been immersed in the viscous fluid are mounted on the transferred viscous fluid. Accordingly, the conductive balls can be fixed onto the circuit board by the viscous fluid, which is transferred onto the circuit board by the transfer pins, and the viscous fluid that adheres to the conductive balls due to the immersion of the conductive balls in the viscous fluid.
Public/Granted literature
- US20150060529A1 BALL MOUNTING METHOD AND WORKING MACHINE FOR BOARD Public/Granted day:2015-03-05
Information query
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