Invention Grant
- Patent Title: Method of forming pattern and method of manufacturing integrated circuit device by using the same
-
Application No.: US15083321Application Date: 2016-03-29
-
Publication No.: US09768032B2Publication Date: 2017-09-19
- Inventor: Seok-han Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2015-0066253 20150512
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/033 ; H01L21/3213 ; H01L21/02 ; H01L27/108

Abstract:
A method of forming a pattern including forming a feature layer on a substrate having first and second regions; forming a first guide pattern on the first region, the first guide pattern having openings therein, the openings exposing the feature layer; forming a second guide pattern covering the feature layer exposed through the first guide pattern on the first region and covering the second region; forming a block copolymer layer covering the first guide pattern and the second guide pattern on the first and second regions; phase-separating the block copolymer layer to form first vertical domains and a second vertical domain; removing the first vertical domains on the first region; and etching the first guide pattern and the feature layer using the second vertical domain as an etch mask on the first region to form a feature pattern having holes therein.
Public/Granted literature
- US20160336192A1 METHOD OF FORMING PATTERN AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME Public/Granted day:2016-11-17
Information query
IPC分类: