- Patent Title: Semiconductor package resin composition and usage method thereof
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Application No.: US14810631Application Date: 2015-07-28
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Publication No.: US09773714B2Publication Date: 2017-09-26
- Inventor: Kohichiro Kawate , Hiroko Akiyama , Naota Sugiyama , Brant U. Kolb , Eric G. Larson
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Adam Bramwell
- Main IPC: H01L23/29
- IPC: H01L23/29 ; C08L63/00 ; H01L23/10 ; H01L21/56 ; C08K3/36 ; C08K9/06 ; H01L33/56
Abstract:
A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.
Public/Granted literature
- US20150329740A1 Semiconductor Package Resin Composition and Usage Method Thereof Public/Granted day:2015-11-19
Information query
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