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公开(公告)号：US20140217622A1
公开(公告)日：2014-08-07
申请号：US14131827
申请日：2012-07-09
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Kohichiro Kawate , Hiroko Akiyama , Naota Sugiyama , Brant U. Kolb , Eric G. Larson
CPC classification number: H01L23/296 , C08K3/36 , C08K9/06 , C08L63/00 , H01L21/563 , H01L23/10 , H01L23/293 , H01L23/295 , H01L33/56 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/92125 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.
Abstract translation: 本发明的半导体封装树脂组合物包括环氧树脂，固化剂，无机颗粒，用含有光聚合官能团的硅烷表面处理的纳米颗粒和光聚合引发剂。
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2.发明公开公开(公告)号：US20230383114A1
公开(公告)日：2023-11-30
申请号：US18366753
申请日：2023-08-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Brett A. Beiermann , John C. Clark , Eric G. Larson , Jeremy M. Higgins , Audrey S. Forticaux , Jay R. Lomeda , Wayne S. Mahoney , Scott B. Charles , Timothy D. Fletcher , Wendy L. Thompson , Kyle R. Schwartz
CPC classification number: C08L63/00 , C08K3/14 , C08K3/22 , C08K3/38 , C08K7/20 , H05K5/02 , C08K2003/2227 , C08K2003/385 , C08K2201/001 , C08K2201/009
Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.
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3.发明申请LAMINATE BODY, METHOD, AND MATERIALS FOR TEMPORARY SUBSTRATE SUPPORT AND SUPPORT SEPARATION 审中-公开层状材料，方法和材料的临时基板支持和支持分离公开(公告)号：US20150034238A1
公开(公告)日：2015-02-05
申请号：US14385401
申请日：2013-03-06
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Blake R. Dronen , Wayne S. Mahoney , Eric G. Larson
IPC: H01L21/683 , B32B38/10 , C09J7/02 , B32B7/06
CPC classification number: H01L21/6836 , B32B7/06 , B32B38/10 , C09J7/385 , C09J7/401 , C09J2203/326 , C09J2433/00 , C09J2433/005 , H01L21/67092 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , Y10T156/10 , Y10T428/1452 , Y10T428/1457 , Y10T428/1476
Abstract: A laminate body, method, and materials for temporary substrate support are provided. The laminate body can hold N and protect thin, brittle substrates such as flexible glass or thin semiconductor wafers during further processing such as vapor deposition or thinning by grinding. The provided laminate body, in one embodiment, includes a support, a release layer disposed upon the support, a joining layer disposed upon and in contact with the release layer, and a substrate disposed upon and in contact with the joining layer. The release layer can include an acrylic adhesive and an adhesion modifying agent.
Abstract translation: 提供了层叠体，方法和用于临时衬底支撑的材料。 层压体可以在进一步加工例如气相沉积或通过研磨减薄的过程中保护N并且保护薄的，脆性的基材例如柔性玻璃或薄的半导体晶片。 在一个实施方案中，提供的层压体包括支撑体，设置在支撑体上的剥离层，设置在剥离层上并与释放层接触的接合层，以及设置在接合层上并与接合层接触的基底。 脱模层可以包括丙烯酸粘合剂和粘合改性剂。
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4.发明授权公开(公告)号：US11773254B2
公开(公告)日：2023-10-03
申请号：US16756518
申请日：2018-12-21
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Brett A. Beiermann , John C. Clark , Eric G. Larson , Jeremy M. Higgins , Audrey S. Forticaux , Jay R. Lomeda , Wayne S. Mahoney , Scott B. Charles , Timothy D. Fletcher , Wendy L. Thompson , Kyle R. Schwartz
CPC classification number: C08L63/00 , C08K3/14 , C08K3/22 , C08K3/38 , C08K7/20 , H05K5/02 , C08K2003/2227 , C08K2003/385 , C08K2201/001 , C08K2201/009
Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.
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公开(公告)号：US20150329740A1
公开(公告)日：2015-11-19
申请号：US14810631
申请日：2015-07-28
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Kohichiro Kawate , Hiroko Akiyama , Naota Sugiyama , Brant U. Kolb , Eric G. Larson
IPC: C09D163/00 , C08K3/36 , H01L23/29
CPC classification number: H01L23/296 , C08K3/36 , C08K9/06 , C08L63/00 , H01L21/563 , H01L23/10 , H01L23/293 , H01L23/295 , H01L33/56 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/92125 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.
Abstract translation: 本发明的半导体封装树脂组合物包括环氧树脂，固化剂，无机颗粒，用含有光聚合官能团的硅烷表面处理的纳米颗粒和光聚合引发剂。
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Patent Agency Ranking
公开(公告)号：US20250129204A1
公开(公告)日：2025-04-24
申请号：US18835189
申请日：2023-02-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Yangbin Chen , Eric G. Larson
Abstract: Curable compositions include a non-aromatic epoxy-functional epoxy resin adduct, a non-aromatic epoxy resin, and a non-aromatic anhydride-based curing agent. The epoxy resin adduct is the reaction product of a reaction mixture including a polyfunctional thiol and a poly functional epoxy resin. The cured composition has an Izod Impact Test (Notched Izod) test method (ASTM D256) value of at least 40 J/m and is color stable such that upon exposure to an acid bath in accordance with the Acid Bath Test Method, exhibits a ΔE 94 color change of less than 1.
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公开(公告)号：US20230265279A1
公开(公告)日：2023-08-24
申请号：US18043667
申请日：2021-09-09
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Abstract: A curable composition includes a non-aromatic epoxy resin; a non-aromatic curing agent; and a colorant. The cured composition that is the reaction product of the curable composition exhibits a non-overlap shear value on etched aluminum of at least 30 MPa.
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8.发明申请公开(公告)号：US20200283619A1
公开(公告)日：2020-09-10
申请号：US16756518
申请日：2018-12-21
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Brett A. Beiermann , John C. Clark , Eric G. Larson , Jeremy M. Higgins , Audrey S. Forticaux , Jay R. Lomeda , Wayne S. Mahoney , Scott B. Charles , Timothy D. Fletcher , Wendy L. Thompson , Kyle R. Schwartz
Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure maybe a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.
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9.发明申请公开(公告)号：US20200208020A1
公开(公告)日：2020-07-02
申请号：US16643606
申请日：2018-09-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Eric G. Larson , Michael A. Kropp , Matthew J. Kryger , Shijing Cheng
Abstract: A thermally curable adhesive film, a tape, and a method of making the tape, wherein the film includes: a crosslinked (meth)acrylate matrix; and a thermally curable, one-part epoxy/thiol resin composition incorporated within the crosslinked (meth)acrylate matrix; wherein the thermally curable, one-part epoxy/thiol resin composition comprises: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two thiol groups; a nitrogen-containing catalyst for the epoxy resin; and an organic acid.
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公开(公告)号：US11884850B2
公开(公告)日：2024-01-30
申请号：US16643606
申请日：2018-09-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Eric G. Larson , Michael A. Kropp , Matthew J. Kryger , Shijing Cheng
CPC classification number: C09J7/35 , C09J11/06 , F16B15/0092 , C09J2433/00 , C09J2463/00
Abstract: A thermally curable adhesive film, a tape, and a method of making the tape, wherein the film includes: a crosslinked (meth)acrylate matrix; and a thermally curable, one-part epoxy/thiol resin composition incorporated within the crosslinked (meth)acrylate matrix; wherein the thermally curable, one-part epoxy/thiol resin composition comprises: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a thiol component comprising a polythiol compound having at least two thiol groups; a nitrogen-containing catalyst for the epoxy resin; and an organic acid.
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