Techniques for hyperspectral imaging, including a device for hyperspectral imaging including at least one tunable interferometer including a thin layer of material disposed between two or more broadband mirrors. Electrodes placed on either side of the tunable interferometer can be coupled to a voltage control circuit, and upon application of a voltage across the tunable interferometer, the distance between the mirrors can be modulated by physically altering the dimensions of the thin layer of material, which can uniformly load the broadband mirrors. Physically altering the dimensions of the thin layer of material can include one or more of deformation of a soft material, piezostrictrive actuation of a piezostrictrive material, or electrostrictive actuation of an electrostrictive material.