Invention Grant
- Patent Title: Interconnects through dielectric vias
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Application No.: US15364240Application Date: 2016-11-29
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Publication No.: US09780028B2Publication Date: 2017-10-03
- Inventor: Kevin Dooley , Roger McQuaid , Liam Cheevers , David Fitzpatrick , Lorraine Byrne
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/522 ; H01L23/532 ; H01L21/768 ; H01L23/528 ; H01L27/12
Abstract:
A dielectric layer includes a reflow via. The reflow via is formed by reflow of the dielectric layer away from a raised feature. An interconnect is in contact with the raised feature through the reflow via.
Public/Granted literature
- US20170084533A1 INTERCONNECTS THROUGH DIELECTRIC VIAS Public/Granted day:2017-03-23
Information query
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