Invention Grant
- Patent Title: Method of measuring asymmetry, inspection apparatus, lithographic system and device manufacturing method
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Application No.: US14971887Application Date: 2015-12-16
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Publication No.: US09786044B2Publication Date: 2017-10-10
- Inventor: Andreas Fuchs , Peter Hanzen Wardenier , Amandev Singh , Maxime D'Alfonso , Hilko Dirk Bos
- Applicant: ASML NETHERLANDS B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML NETHERLANDS B.V.
- Current Assignee: ASML NETHERLANDS B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Priority: EP14199200 20141219
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06T7/00 ; G03F7/20 ; G06T7/11

Abstract:
A scatterometer is used in a dark-field imaging mode to measure asymmetry-related parameters such as overlay. Measurements of small grating targets are made using identical optical paths, with the target in two orientations to obtain separate measurements of +1 and −1 diffraction orders. In this way, intensity scaling differences (tool asymmetry) are avoided. However, additive intensity defects due to stray radiation (ghosts) in the optical system cannot be avoided. Additive intensity issues strongly depend on the ratio between 0th and 1st order diffraction and are therefore strongly substrate (process) dependent. Calibration measurements are made on a few representative target gratings having biases. The calibration measurements are made, using not only different substrate rotations but also complementary apertures. Corrections are calculated and applied to correct asymmetry, to reduce error caused by stray radiation.
Public/Granted literature
- US20160180517A1 METHOD OF MEASURING ASYMMETRY, INSPECTION APPARATUS, LITHOGRAPHIC SYSTEM AND DEVICE MANUFACTURING METHOD Public/Granted day:2016-06-23
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