Method of inspecting a substrate, metrology apparatus, and lithographic system

    公开(公告)号:US10534274B2

    公开(公告)日:2020-01-14

    申请号:US15723820

    申请日:2017-10-03

    Abstract: Metrology apparatus and methods for inspecting a substrate are disclosed. A source beam of radiation emitted by a radiation source is split into a measurement beam and a reference beam. A first target on the substrate is illuminated with the measurement beam. A second target separated from the substrate is illuminated with the reference beam. First scattered radiation collected from the first target and second scattered radiation collected from the second target are delivered to the detector. The first scattered radiation interferes with the second scattered radiation at the detector. The first target comprises a first pattern. The second target comprises a second pattern, or a pupil plane image of the second pattern. The first pattern is geometrically identical to the second pattern, the first pattern and the second pattern are periodic and a pitch of the first pattern is identical to a pitch of the second pattern, or both.

    Measurement system, lithographic system, and method of measuring a target

    公开(公告)号:US10437159B2

    公开(公告)日:2019-10-08

    申请号:US15802701

    申请日:2017-11-03

    Abstract: A measurement system is disclosed in which a first optical system splits an input radiation beam into a plurality of components. A modulator receives the plurality of components and applies a modulation to at least one of the components independently of at least one other of the components. A second optical system illuminates a target with the plurality of components and directs radiation scattered by the target to a detection system. The detection system distinguishes between each of one or more components, or between each of one or more groups of components, of the radiation directed to the detection system based on the modulation applied to each component or each group of components by the modulator.

    Method of Inspecting a Substrate, Metrology Apparatus, and Lithographic System

    公开(公告)号:US20180107124A1

    公开(公告)日:2018-04-19

    申请号:US15723820

    申请日:2017-10-03

    Abstract: Metrology apparatus and methods are disclosed. In one arrangement, a substrate is inspected. A source beam of radiation emitted by a radiation source is split into a measurement beam and a reference beam. A first target is illuminated with the measurement beam, the first target being on the substrate. A second target is illuminated with the reference beam, the second target being separated from the substrate. First scattered radiation is collected from the first target and delivered to a detector. Second scattered radiation is collected from the second target and delivered to the detector. The first scattered radiation interferes with the second scattered radiation at the detector. The first target comprises a first pattern. The second target comprises a second pattern, or a pupil plane image of the second pattern. The first pattern is geometrically identical to the second pattern, the first pattern and the second pattern are periodic and a pitch of the first pattern is identical to a pitch of the second pattern, or both.

    Focus monitoring arrangement and inspection apparatus including such an arrangement

    公开(公告)号:US09921489B2

    公开(公告)日:2018-03-20

    申请号:US14867594

    申请日:2015-09-28

    CPC classification number: G03F7/70641 G02B21/245 G03F7/70616 G03F9/7026

    Abstract: An inspection apparatus (300) includes a focus monitoring arrangement (500, 500′). Focusing radiation (505) comprises radiation having a first wavelength and radiation having a second wavelength. Reference radiation and focusing radiation at each wavelength are provided with at least one relative frequency shift so that the interfering radiation detected in the detection system includes a time-varying component having a characteristic frequency. A focus detection system (520) comprises one or more lock-in detectors (520b, 520c, 900). Operating the lock-in detectors with reference to both the first and second characteristic frequencies allows the arrangement to select which of the first and second focusing radiation is used to determine whether the optical system is in focus. Good quality signals can be obtained from targets of different structure.

    Inspection apparatus and methods, methods of manufacturing devices

    公开(公告)号:US09753379B2

    公开(公告)日:2017-09-05

    申请号:US14794013

    申请日:2015-07-08

    Abstract: Inspection apparatus (100) is used for measuring parameters of targets on a substrate. Coherent radiation follows an illumination path (solid rays) for illuminating target (T). A collection path (dashed rays) collects diffracted radiation from the target and delivers it to a lock-in image detector (112). A reference beam following a reference path (dotted rays). An acousto-optical modulator (108) shifts the optical frequency of the reference beam so that the intensity of radiation at the lock-in detector includes a time-varying component having a characteristic frequency corresponding to a difference between the frequencies of the diffracted radiation and the reference radiation. The lock-in image detector records two-dimensional image information representing both amplitude and phase of the time-varying component. A second reference beam with a different shift (110) follows a second reference path (dot-dash rays). Interference between the two reference beams can be used for intensity normalization.

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