Invention Grant
- Patent Title: Semiconductor device and measurement device
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Application No.: US14987084Application Date: 2016-01-04
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Publication No.: US09787250B2Publication Date: 2017-10-10
- Inventor: Kengo Takemasa , Yuichi Yoshida , Toshihisa Sone , Kazuya Yamada , Akihiro Takei
- Applicant: LAPIS Semiconductor Co., Ltd.
- Applicant Address: JP Yokohama
- Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee Address: JP Yokohama
- Agency: Rabin & Berdo, P.C.
- Priority: JP2012-104073 20120427; JP2012-104074 20120427; JP2012-104176 20120427; JP2012-104182 20120427
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48 ; H01L23/52 ; H03B5/30 ; H03L1/02 ; H01L23/31 ; H01L23/34 ; H01L23/00 ; H01L21/56
Abstract:
A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.
Public/Granted literature
- US20160118938A1 SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE Public/Granted day:2016-04-28
Information query
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