Invention Grant
- Patent Title: Micromechanical semiconductor sensing device
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Application No.: US15268244Application Date: 2016-09-16
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Publication No.: US09790086B2Publication Date: 2017-10-17
- Inventor: Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: G01B7/16
- IPC: G01B7/16 ; B81B7/02 ; G01L9/00 ; G01L19/02 ; G01L19/00 ; B81B3/00 ; G01L1/18
Abstract:
A micromechanical semiconductor sensing device is disclosed. In an embodiment the sensing device includes a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, the piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
Public/Granted literature
- US20170003180A1 Micromechanical Semiconductor Sensing Device Public/Granted day:2017-01-05
Information query
