Invention Grant
- Patent Title: Compliant thermal contact device and method
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Application No.: US13625334Application Date: 2012-09-24
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Publication No.: US09791501B2Publication Date: 2017-10-17
- Inventor: Paul Diglio , David W. Song
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G01R31/10
- IPC: G01R31/10 ; G01R31/28 ; F28F13/00
Abstract:
Examples of thermal contact devices and methods are shown. Compliant thermal contact devices are shown that include interleaved conducting structures to provide a high thermal conduction contact area. Selected examples include a thermal interface material located at the interleaved interface between the conducting structures. Selected examples also include designs for alternate chip orientations.
Public/Granted literature
- US20140084953A1 COMPLIANT THERMAL CONTACT DEVICE AND METHOD Public/Granted day:2014-03-27
Information query
