Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15341332Application Date: 2016-11-02
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Publication No.: US09793196B2Publication Date: 2017-10-17
- Inventor: Akira Matsumoto , Yoshinao Miura , Yasutaka Nakashiba
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Womble Carlyle
- Priority: JP2013-158833 20130731
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/495 ; H01L27/088 ; H01L27/02 ; H01L29/417 ; H01L23/485 ; H01L23/50 ; H01L23/492 ; H01L23/00 ; H01L27/06 ; H01L29/423 ; H01L29/78 ; H01L29/778 ; H01L29/20 ; H01L23/482 ; H01L29/205 ; H01L29/10

Abstract:
Disclosed is a semiconductor device in which a resistance component resulting from wiring is reduced. A plurality of transistor units are arranged side by side in a first direction, each of which has a plurality of transistors. The gate electrodes of the transistors extend in the first direction. First source wiring extends between first transistor unit and second transistor unit, and first drain wiring extends between the second transistor unit and third transistor unit. Second drain wiring extends on the side of the first transistor unit opposite to the side where the first source wiring extends, and second source wiring extends on the side of the third transistor unit opposite to the side where the second drain wiring extends.
Public/Granted literature
- US20170077013A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-03-16
Information query
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