发明授权
- 专利标题： Conductive connections, structures with such connections, and methods of manufacture
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申请号： US14275519申请日： 2014-05-12
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公开(公告)号： US09793198B2公开(公告)日： 2017-10-17
- 发明人: Cyprian Emeka Uzoh , Rajesh Katkar
- 申请人： Invensas Corporation
- 申请人地址： US CA San Jose
- 专利权人： INVENSAS CORPORATION
- 当前专利权人： INVENSAS CORPORATION
- 当前专利权人地址： US CA San Jose
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; B23K35/22 ; B23K35/02 ; B32B15/01 ; H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L25/065 ; H01L25/10 ; H01L25/00 ; B23K1/00 ; B23K101/40
摘要：
A solder connection may be surrounded by a solder locking layer (1210, 2210) and may be recessed in a hole (1230) in that layer. The recess may be obtained by evaporating a vaporizable portion (1250) of the solder connection. Other features are also provided.
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