The present invention describes essentially three different embodiments for the implementation of low impedance (over frequency) power delivery to a die. Such low impedance to a high frequency allows the die to operate at package-level speed, thus reducing yield loss at the packaging level. Each embodiment addresses a slightly different aspect of the overall wafer probe application. In each embodiment, however, the critical improvement of this disclosure is the location of the passive components used for supply filtering/decoupling relative to prior art. All three embodiments require a method to embed the passive components in close proximity to the pitch translation substrate or physically in the pitch translation substrate.