Invention Grant
- Patent Title: Insulated gate type semiconductor device and method for fabricating the same
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Application No.: US14976873Application Date: 2015-12-21
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Publication No.: US09793342B2Publication Date: 2017-10-17
- Inventor: Hiroshi Inagawa , Nobuo Machida , Kentaro Oishi
- Applicant: RENESAS ELECTRONICS CORPORATION , RENESAS SEMICONDUCTOR PACKAGE & TEST SOLUTIONS CO., LTD.
- Applicant Address: JP Tokyo JP Gunma
- Assignee: Renesas Electronics Corporation,Renesas Semiconductor Package & Test Solutions Co., Ltd
- Current Assignee: Renesas Electronics Corporation,Renesas Semiconductor Package & Test Solutions Co., Ltd
- Current Assignee Address: JP Tokyo JP Gunma
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2001-042352 20010219
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/66 ; H01L29/739 ; H01L29/423 ; H01L29/51 ; H01L29/417

Abstract:
In an insulated-gate type semiconductor device in which a gate-purpose conductive layer is embedded into a trench which is formed in a semiconductor substrate, and a source-purpose conductive layer is provided on a major surface of the semiconductor substrate, a portion of a gate pillar which is constituted by both the gate-purpose conductive layer and a cap insulating film for capping an upper surface of the gate-purpose conductive layer is projected from the major surface of the semiconductor substrate; a side wall spacer is provided on a side wall of the projected portion of the gate pillar; and the source-purpose conductive layer is connected to a contact region of the major surface of the semiconductor substrate, which is defined by the side wall spacer.
Public/Granted literature
- US20160111490A1 INSULATED GATE TYPE SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2016-04-21
Information query
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