- 专利标题: Insulated gate bipolar transistor structure having low substrate leakage
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申请号: US15191745申请日: 2016-06-24
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公开(公告)号: US09793385B2公开(公告)日: 2017-10-17
- 发明人: Ker-Hsiao Huo , Fu-Chih Yang , Jen-Hao Yeh , Chun Lin Tsai , Chih-Chang Cheng , Ru-Yi Su
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Haynes and Boone, LLP
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/739 ; H01L21/265 ; H01L21/762 ; H01L29/78 ; H01L29/08 ; H01L29/49 ; H01L29/423 ; H01L29/06 ; H01L29/10
摘要:
A high voltage metal-oxide-semiconductor laterally diffused device (HV LDMOS), and more particularly an insulated gate bipolar junction transistor (IGBT), is disclosed. The device includes a semiconductor substrate, a gate structure formed on the substrate, a source and a drain formed in the substrate on either side of the gate structure, a first doped well formed in the substrate, and a second doped well formed in the first well. The gate, source, second doped well, a portion of the first well, and a portion of the drain structure are surrounded by a deep trench isolation feature and an implanted oxygen layer in the silicon substrate.
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