Invention Grant
- Patent Title: Vacuum adsorption apparatus and a vacuum adsorption method of semiconductor package
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Application No.: US14656645Application Date: 2015-03-12
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Publication No.: US09795918B2Publication Date: 2017-10-24
- Inventor: Yong-Ki Kim , Joo-Hoon Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2014-0050752 20140428
- Main IPC: B01D53/02
- IPC: B01D53/02 ; B01D53/26 ; H01L21/67 ; H01L21/683
Abstract:
Provided is a vacuum adsorption apparatus and a method of adsorbing a semiconductor package in a vacuum state. The vacuum adsorption apparatus includes a housing having an opening formed on its top surface, a vacuum adsorption unit disposed in the housing, and a stage formed on the opening formed in the housing and including a plurality of holes. A pressure generated from the vacuum adsorption unit is applied to the top surface of the stage through the opening and the plurality of holes.
Public/Granted literature
- US20150311059A1 VACUUM ADSORPTION APPARATUS AND A VACUUM ADSORPTION METHOD OF SEMICONDUCTOR PACKAGE Public/Granted day:2015-10-29
Information query
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