公开(公告)号：US09795918B2

公开(公告)日：2017-10-24

申请号：US14656645

申请日：2015-03-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Ki Kim ,  Joo-Hoon Choi

IPC: B01D53/02 ,  B01D53/26 ,  H01L21/67 ,  H01L21/683

CPC classification number: B01D53/261 ,  H01L21/67034 ,  H01L21/6838

Abstract: Provided is a vacuum adsorption apparatus and a method of adsorbing a semiconductor package in a vacuum state. The vacuum adsorption apparatus includes a housing having an opening formed on its top surface, a vacuum adsorption unit disposed in the housing, and a stage formed on the opening formed in the housing and including a plurality of holes. A pressure generated from the vacuum adsorption unit is applied to the top surface of the stage through the opening and the plurality of holes.