- 专利标题： Substrate with high fracture strength
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申请号： US12534203申请日： 2009-08-03
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公开(公告)号： US09797069B2公开(公告)日： 2017-10-24
- 发明人: Jer-Liang Andrew Yeh
- 申请人： Jer-Liang Andrew Yeh
- 申请人地址： TW Hsinchu
- 专利权人： National Tsing Hua University
- 当前专利权人： National Tsing Hua University
- 当前专利权人地址： TW Hsinchu
- 代理机构： Sinorica, LLC
- 代理商 Ming Chow
- 优先权： TW097129793A 20080806
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; C30B33/10 ; B82Y40/00 ; H01L29/34 ; H01L31/0236 ; H01L29/06
摘要：
The invention discloses a substrate with high fracture strength. The substrate according to the invention includes a plurality of nanostructures. The substrate has a first surface, and the nanostructures are protruded from the first surface. By the formation of the nanostructures, the fracture strength of the substrate is enhanced.
公开/授权文献
- US20100035022A1 Substrate with High Fracture Strength 公开/授权日：2010-02-11