- 专利标题： Electromagnetic relay
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申请号： US14779826申请日： 2013-07-31
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公开(公告)号： US09805893B2公开(公告)日： 2017-10-31
- 发明人: Seiki Shimoda
- 申请人： OMRON Corporation
- 申请人地址： JP Kyoto
- 专利权人： OMRON Corporation
- 当前专利权人： OMRON Corporation
- 当前专利权人地址： JP Kyoto
- 代理机构： Osha Liang LLP
- 优先权： JP2013-089831 20130422
- 国际申请： PCT/JP2013/070803 WO 20130731
- 国际公布： WO2014/174694 WO 20141030
- 主分类号： H01H50/16
- IPC分类号： H01H50/16 ; H01H50/36 ; H01H50/28 ; H01H50/64 ; C23C10/54 ; C23C10/56
摘要：
An electromagnetic relay (100) has high wear resistance, high corrosion resistance, and good magnetic properties. The electromagnetic relay (100) includes a magnetic component including an alloy layer on its surface formed by diffusion-coating of at least one element selected from the group consisting of Cr, V, Ti, and Al. The alloy layer has a thickness of 5 to 60 μm, inclusive.
公开/授权文献
- US20160086754A1 ELECTROMAGNETIC RELAY 公开/授权日：2016-03-24
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