-
公开(公告)号：US10602613B2
公开(公告)日：2020-03-24
申请号：US15560264
申请日：2016-03-08
申请人： OMRON Corporation
发明人： Seiki Shimoda , Masaaki Abe
摘要： An electronic device where molten solder does not come into contact with a sealant so as not to destroy a sealing function. An electronic device is provided with: an insulating base mounted on a printed circuit board; a common planar terminal provided so as to extend from an outer side surface to a bottom surface edge of the insulating base, and cause electrical continuity between the outer side surface and the bottom surface edge of the insulating base; a cover fitted to the insulating base and covering the common planar terminal; and a sealant sealing a gap between the outer side surface of the insulating base and an inner circumferential surface of the cover. A solder pool is formed in a position surrounded by the printed circuit board and the common planar terminal at the bottom surface edge of the insulating base.
-
公开(公告)号：US09805893B2
公开(公告)日：2017-10-31
申请号：US14779826
申请日：2013-07-31
申请人： OMRON Corporation
发明人： Seiki Shimoda
CPC分类号： H01H50/36 , C23C10/54 , C23C10/56 , H01H50/16 , H01H50/163 , H01H50/28 , H01H50/642 , H01H2209/002
摘要： An electromagnetic relay (100) has high wear resistance, high corrosion resistance, and good magnetic properties. The electromagnetic relay (100) includes a magnetic component including an alloy layer on its surface formed by diffusion-coating of at least one element selected from the group consisting of Cr, V, Ti, and Al. The alloy layer has a thickness of 5 to 60 μm, inclusive.
-
公开(公告)号：US20180075993A1
公开(公告)日：2018-03-15
申请号：US15560282
申请日：2016-03-08
申请人： OMRON Corporation
发明人： Seiki Shimoda , Masaaki Abe
CPC分类号： H01H50/02 , H01H50/021 , H01H50/14 , H01H50/443 , H01R12/57 , H01R12/732 , H01R13/03 , H01R31/06 , H05K1/119 , H05K2201/09145 , H05K2203/107
摘要： A terminal connection structure with a good material yield and high productivity, free of mounting failure. The terminal connection structure is provided with: a base including a terminal hole, a fixed contact terminal portion, a through hole passing through the fixed contact terminal portion along its shaft center and communicating with the terminal hole, and a conductive film formed in a continuous manner on an inner circumferential surface of the terminal hole, an inner circumferential surface of the through hole, and an exposed surface of the fixed contact terminal portion; and a touch piece press-fitted into the terminal hole and electrically connected to the fixed contact terminal portion via the conductive film.
-
公开(公告)号：US20180070449A1
公开(公告)日：2018-03-08
申请号：US15560264
申请日：2016-03-08
申请人： OMRON Corporation
发明人： Seiki Shimoda , Masaaki Abe
CPC分类号： H05K1/181 , H01H50/023 , H01H50/043 , H01H50/047 , H01H50/14 , H01H51/229 , H01H2001/5888 , H05K2201/10053 , H05K2201/1078 , H05K2201/10803 , H05K2201/10931
摘要： An electronic device where molten solder does not come into contact with a sealant so as not to destroy a sealing function. An electronic device is provided with: an insulating base mounted on a printed circuit board; a common planar terminal provided so as to extend from an outer side surface to a bottom surface edge of the insulating base, and cause electrical continuity between the outer side surface and the bottom surface edge of the insulating base; a cover fitted to the insulating base and covering the common planar terminal; and a sealant sealing a gap between the outer side surface of the insulating base and an inner circumferential surface of the cover. A solder pool is formed in a position surrounded by the printed circuit board and the common planar terminal at the bottom surface edge of the insulating base.
-
公开(公告)号：US10964504B2
公开(公告)日：2021-03-30
申请号：US15754612
申请日：2016-11-16
申请人： OMRON CORPORATION
发明人： Seiki Shimoda , Yuichiro Teshima , Akira Tsurusaki
摘要： The movable body includes a pivot and a contact portion. The pivot is rotatably supported. The contact portion is disposed at a position contactable with a contact piece. The movable body rotates around the pivot and presses the contact piece via the contact portion to move the second contact close to the first contact. The actuator presses the movable body to rotate the movable body around the pivot. The contact piece has a curved portion located between the second contact and the support. The pivot is located on a side where the support is disposed with respect to the curved portion. The actuator includes a pressing member which presses the movable body. The pressing member moves in an axial direction of the pressing member to press the movable body.
-
公开(公告)号：US10685801B2
公开(公告)日：2020-06-16
申请号：US15876072
申请日：2018-01-19
申请人： OMRON Corporation
发明人： Seiki Shimoda , Tsuyoshi Okubo
摘要： An electromagnetic device includes a spool having a cylindrical body with a through hole, a secondary coil formed in a spiral shape along an outer peripheral surface of the cylindrical body and formed with a closed circuit by metal plating, and a primary coil formed of a conductive wire wound around the secondary coil via an insulating material covering the secondary coil. An induced current, generated by applying a voltage to any one of the primary coil and the secondary coil, is allowed to flow to the other coil different from the one coil.
-
公开(公告)号：US11587751B2
公开(公告)日：2023-02-21
申请号：US16956655
申请日：2018-12-26
申请人： OMRON Corporation
发明人： Seiki Shimoda , Kenshi Hayashida , Takeshi Noguchi
摘要： An electromagnetic relay and a terminal block each include a voltage converter. The voltage converter is located adjacent to a coil and electrically connected to first coil terminals and second coil terminals. The voltage converter converts a power supply voltage input through one of the first coil terminals to a set value different from the input power supply voltage and outputs the power supply voltage to an electromagnet through one of the second coil terminals.
-
公开(公告)号：US10714291B2
公开(公告)日：2020-07-14
申请号：US15754772
申请日：2016-11-16
申请人： OMRON CORPORATION
发明人： Seiki Shimoda , Akira Tsurusaki
摘要： The pressing member is configured to move to an off-position and an on-position. When the pressing member is located at the off-position, the first contact and the second contact come into a non-contact state. When the pressing member is located at the on-position, the first contact and the second contact come into a contact state by press of the pressing member against the contact piece. The actuator moves the pressing member from the off-position to the on-position via an overshoot position located beyond the on-position. The contact piece includes a body, and a low rigidity portion having rigidity lower than rigidity of the body. The pressing member presses the low rigidity portion.
-
公开(公告)号：US20160086754A1
公开(公告)日：2016-03-24
申请号：US14779826
申请日：2013-07-31
申请人： OMRON CORPORATION
发明人： Seiki Shimoda
IPC分类号： H01H50/36
CPC分类号： H01H50/36 , C23C10/54 , C23C10/56 , H01H50/16 , H01H50/163 , H01H50/28 , H01H50/642 , H01H2209/002
摘要： An electromagnetic relay (100) has high wear resistance, high corrosion resistance, and good magnetic properties. The electromagnetic relay (100) includes a magnetic component including an alloy layer on its surface formed by diffusion-coating of at least one element selected from the group consisting of Cr, V, Ti, and Al. The alloy layer has a thickness of 5 to 60 μm, inclusive.
摘要翻译： 电磁继电器（100）具有高耐磨性，高耐腐蚀性和良好的磁性能。 电磁继电器（100）包括磁性部件，该磁性部件包括在其表面上形成的合金层，该合金层通过从Cr，V，Ti和Al组成的组中选择的至少一种元素进行扩散涂覆而形成。 合金层的厚度为5〜60μm。
-
公开(公告)号：US11096280B2
公开(公告)日：2021-08-17
申请号：US16605739
申请日：2018-05-17
申请人： Omron Corporation
发明人： Daichi Shimoda , Kazumune Kishikawa , Yasuyuki Kitahara , Tomonori Shiraishi , Shigeyuki Maeda , Yuta Fujise , Seiki Shimoda
摘要： A relay includes a relay main body (10) including a base (20) having a first surface (21), and a relay substrate (30) extending, in a direction intersecting the first surface (21), from a second surface (22) on the opposite side of the base (20) from the first surface (21), the relay substrate (30) being united with the base (20), and a case (50) attached to the relay main body (10) to cover the relay substrate (30), and the case (50) being filled with sealant. The relay main body (10) includes a board connector (23) provided on the first surface (21) of the base (20), an electronic component mounting portion (33) provided on the relay substrate (30), a conducting portion (40) provided on respective surfaces of the base (20) and the relay substrate (30), and an electronic component (34) mounted on the electronic component mounting portion (33).
-
-
-
-
-
-
-
-
-
搜索结果
13 条记录 (耗时 0.013 秒)
