Invention Grant
- Patent Title: Electronic circuit and method of fabricating the same
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Application No.: US13772288Application Date: 2013-02-20
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Publication No.: US09807886B2Publication Date: 2017-10-31
- Inventor: Chan Woo Park , Jae Bon Koo , Sang Chul Lim , Ji-Young Oh , Soon-Won Jung
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Priority: KR10-2012-0105893 20120924
- Main IPC: H05K3/34
- IPC: H05K3/34 ; H05K3/10 ; H05K1/02 ; H05K3/00 ; H05K1/18 ; H05K3/28

Abstract:
Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force applied to the electronic circuit may be absorbed by the uneven portion and the conductive line. The electronic device may not be affected by the external force. Therefore, functions of the electronic circuit may be maintained. A method of fabricating an electronic circuit according to the present invention may easily adjust areas and positions of the interconnection region and the device region.
Public/Granted literature
- US20140085840A1 ELECTRONIC CIRCUIT AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-03-27
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