- 专利标题: Semiconductor device
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申请号: US15180851申请日: 2016-06-13
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公开(公告)号: US09818838B2公开(公告)日: 2017-11-14
- 发明人: Tsutomu Komatani
- 申请人: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- 申请人地址: JP Yokohama-shi
- 专利权人: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- 当前专利权人: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- 当前专利权人地址: JP Yokohama-shi
- 代理机构: Westerman, Hattori, Daniels & Adrian, LLP
- 优先权: JP2012-279752 20121221
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L21/02 ; H01L21/3105 ; H01L21/3115 ; H01L29/778 ; H01L29/20 ; H01L21/24 ; H01L29/04 ; H01L29/16 ; H01L21/285
摘要:
A method for fabricating a semiconductor device includes: forming a silicon nitride film having a refractive index equal to or larger than 2.2 on a nitride semiconductor layer; and introducing at least one of elements that are oxygen, nitrogen, fluorine, phosphorus, sulfur and selenium into the silicon nitride film, the silicon nitride film including the at least one of elements remaining on the nitride semiconductor layer. The at least one of elements is introduced by a process of exposing the silicon nitride film to plasma including the at least one of elements, a process of ion-implanting the at least one of elements into the silicon nitride film, or a process of thermally diffusing the at least one of elements into the silicon nitride film. The silicon nitride film is formed in contact with a surface of the nitride semiconductor layer.
公开/授权文献
- US20160293724A1 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE 公开/授权日:2016-10-06
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