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公开(公告)号:US20250015123A1
公开(公告)日:2025-01-09
申请号:US18740599
申请日:2024-06-12
Applicant: Sumitomo Electric Device Innovations, Inc.
Inventor: Ikuo NAKASHIMA
IPC: H01L23/367 , H01L23/522 , H01L23/64 , H01L23/00
Abstract: An electronic component includes an insulator, a first resistor provided on the insulator, a first electrically insulating film provided on the first resistor to be in contact with the first resistor, and a first metal bonding material provided on the first electrically insulating film to be in contact with the first electrically insulating film and be in contact with a heat sink.
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公开(公告)号:US20250006688A1
公开(公告)日:2025-01-02
申请号:US18214530
申请日:2023-06-27
Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Inventor: Seiya TAKASHIMA
Abstract: A semiconductor device includes a cavity package including a substrate and at least one output lead disposed higher than the substrate, in a side view, to create a cavity. A transistor die is disposed within the cavity. A top surface of the transistor die is lower than a top surface of the output lead when viewed in the side view. A first substrate is disposed within the cavity and is separate from the transistor die. A top surface of the first substrate is lower than the top surface of the output lead in the side view. A shunt wire connects an output of the transistor die to the first substrate, and an output wire connects the output of the transistor substrate to the output lead. The shunt wire or the output wire is disposed and shaped to minimize self-inductance and to minimize mutual inductance with the shunt wire.
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公开(公告)号:US20250006595A1
公开(公告)日:2025-01-02
申请号:US18746698
申请日:2024-06-18
Applicant: Sumitomo Electric Device Innovations, Inc.
Inventor: Yuya TSUTSUMI
IPC: H01L23/482 , H01L27/088 , H01L29/417 , H01L29/423
Abstract: A semiconductor device includes a substrate, a first unit FET including first source, first drain, and first gate electrodes, a second unit FET including second source, second drain, and second gate electrodes, a first source wiring electrically contacting the first source electrode, a gate bus bar electrically connected to the first gate electrode, and interposing the first gate electrode between the gate bus bar and the second gate electrode, and a gate wiring provided above the first source electrode in non-contact with the first source electrode, and electrically connecting the gate bus bar and the second gate electrode, wherein a maximum width in a first direction of a region where the first source wiring contacts the first source electrode is ½ times or more a maximum width in the first direction of a region where the first source wiring overlaps the first source electrode.
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公开(公告)号:US12125774B2
公开(公告)日:2024-10-22
申请号:US17738342
申请日:2022-05-06
Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC
Inventor: Hisashi Shimura , Yoshiyasu Kuwabara
IPC: H01L23/495 , H01L21/56 , H01L23/31 , H01L29/267 , H01L29/78
CPC classification number: H01L23/49562 , H01L21/561 , H01L23/3121 , H01L23/49582 , H01L29/267 , H01L29/78
Abstract: A semiconductor device includes a semiconductor chip in which a field effect transistor mainly containing GaN is formed on a surface of a SiC semiconductor substrate. The semiconductor device includes a metal base on which a back surface of the semiconductor chip is mounted through a conductive adhesive material containing Ag and a resin mold configured to seal the semiconductor chip. A metal having wettability lower than wettability of Au or Cu with respect to Ag is exposed in a region extending along an edge of the back surface.
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公开(公告)号:US20230411319A1
公开(公告)日:2023-12-21
申请号:US18179639
申请日:2023-03-07
Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Inventor: Yuya TSUTSUMI , Masaomi EMORI
IPC: H01L23/00
CPC classification number: H01L24/05 , H01L24/29 , H01L24/32 , H01L24/03 , H01L21/76898
Abstract: A semiconductor device includes a substrate having a first main surface and a second main surface opposite to the first main surface, and a first conductive layer covering the second main surface and including dendrites, wherein a via hole extending through the substrate and having an inner wall surface is formed in the substrate, and wherein the first conductive layer covers the inner wall surface.
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公开(公告)号:US20230379060A1
公开(公告)日:2023-11-23
申请号:US17913736
申请日:2021-03-26
Applicant: Sumitomo Electric Device Innovations, Inc.
Inventor: Ryutaro TAKEI , Takayuki SUZUKI
IPC: H04B10/50 , H04B10/516
CPC classification number: H04B10/503 , H04B10/516
Abstract: An optical transmitter includes an optical transmission unit, a drive unit, an arithmetic circuit, and a bias supply circuit. The optical transmission unit includes a laser element. The drive unit drives the laser element according to a first transmission signal. The arithmetic circuit generates a second transmission signal. The bias supply circuit superimposes the second transmission signal on a bias current of the laser element. An output of the arithmetic circuit containing the second transmission signal is a digital signal in a rectangular wave form based on a reference clock having a frequency lower than a reference clock frequency of the first transmission signal. The bias supply circuit includes a circuit element for inclining a rising portion and a falling portion of the output of the arithmetic circuit.
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公开(公告)号:US11757695B2
公开(公告)日:2023-09-12
申请号:US17542710
申请日:2021-12-06
Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Inventor: Ruikang Yang , Michael Russo , Simon Hamparian
CPC classification number: H04L27/367 , H04L27/2695 , H04L27/3836
Abstract: Various embodiments of the present disclosure relate to transmitter systems, methods, and instructions for signal predistortion. The transmitter system includes an intermodulation distortion (IMD) filter module configured to filter a detected feedback signal (Yin) to generate a targeted filtered signal (Yout), a digital pre-distortion (DPD) coefficient estimation module configured to update signal generation coefficients based on comparing an input signal (Sin) with the targeted filtered signal (Yout), and a distortion compensation processing module configured to generate a pre-distorted signal (Uout) based on the input signal (Sin) using the updated signal generation coefficients.
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公开(公告)号:US11757052B2
公开(公告)日:2023-09-12
申请号:US17188335
申请日:2021-03-01
Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Inventor: Yoshihiro Yoneda , Koji Ebihara , Takuya Okimoto
IPC: H01L31/0232 , H01L31/0304 , H01L31/0352 , H01L31/109
CPC classification number: H01L31/02327 , H01L31/03046 , H01L31/035281 , H01L31/109
Abstract: A semiconductor light receiving element includes a first semiconductor layer, a waveguide type photodiode structure, an optical waveguide structure, and a fourth semiconductor layer. The waveguide type photodiode structure is provided on the first semiconductor layer. The waveguide type photodiode structure includes an optical absorption layer, a second semiconductor layer, a multiplication layer, and a third semiconductor layer. The optical waveguide structure is provided on the first semiconductor layer. The optical waveguide structure includes an optical waveguiding core layer and a cladding layer. An end face of the waveguide type photodiode structure faces to an end face of the optical waveguide structure. The fourth semiconductor layer is located between the end face of the waveguide type photodiode structure and the end face of the optical waveguide structure. The fourth semiconductor layer contacts the multiplication layer at the end face of the waveguide type photodiode structure.
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公开(公告)号:US20230282686A1
公开(公告)日:2023-09-07
申请号:US18108924
申请日:2023-02-13
Applicant: Sumitomo Electric Device Innovations, Inc.
Inventor: Yasuyo YOTSUDA
IPC: H01L21/302
CPC classification number: H01L28/56 , H01L28/75 , H01L21/302
Abstract: A capacitor includes a substrate, a first electrode provided on the substrate, a dielectric film provided on the first electrode, a second electrode provided on the dielectric film and having an outer periphery positioned inside the outer periphery of the first electrode in a plan view viewed from above in a direction normal to an upper surface of the substrate, a third electrode that is in contact with the second electrode in a region inside the second electrode in the plan view, is separated upward from the first electrode and the dielectric film outside the region in the plan view, and has an outer periphery positioned inside the outer periphery of the first electrode and an outer periphery of the dielectric film in the plan view, and a protective film covering the second electrode and the third electrode and being in contact with the second electrode and the third electrode.
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公开(公告)号:US20230213047A1
公开(公告)日:2023-07-06
申请号:US18089662
申请日:2022-12-28
Applicant: Sumitomo Electric Device Innovations, Inc.
Inventor: Masato HINO
CPC classification number: F16B1/00 , G02B6/4278
Abstract: An optical transceiver includes an outer part provided outside the apparatus upon an engagement of the optical transceiver with the apparatus. The outer part includes a first spindle, a rotational member, a sliding member. The rotational member is configured to rotate on the first spindle. The sliding member is configured to move along the first direction. The rotational member has a hole. The sliding member has a second spindle. The first spindle and the second spindle are fit with the hole. The optical transceiver includes an inner part provided inside the apparatus upon the engagement with the apparatus. The hole has a first circular area, a second circular area, and a straight area. The first spindle is fit with the first circular area. The second spindle is fit with the second circular area. The straight area is connected between the first circular area and the second circular area.
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