Invention Grant
- Patent Title: Heat module
-
Application No.: US14630159Application Date: 2015-02-24
-
Publication No.: US09826661B2Publication Date: 2017-11-21
- Inventor: Katsutoshi Kato , Takehito Tamaoka
- Applicant: NIDEC CORPORATION
- Applicant Address: JP Kyoto
- Assignee: NIDEC CORPORATION
- Current Assignee: NIDEC CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2014-133429 20140628
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20 ; G06F1/20

Abstract:
A heat module includes a heat receiving portion, a fluid channel, a fan, a radiator including heat dissipating fins and a radiator tube fluid channel, and a pump. The pump includes a stationary portion and a rotating portion. The rotating portion includes a rotor holder and a pump impeller. The pump further includes a casing, a pump fluid channel, a pump inlet, and a pump outlet. At least a portion of the rotor holder and at least a portion of the pump impeller are arranged to radially overlap with each other. The fluid channel includes a tube fluid channel. The tube fluid channel includes a pump inlet-side tube fluid channel, a pump outlet-side tube fluid channel, and a heat receiving portion tube fluid channel. No heat receiving portion tube fluid channel is arranged in the pump inlet-side tube fluid channel.
Public/Granted literature
- US20150382507A1 HEAT MODULE Public/Granted day:2015-12-31
Information query