Invention Grant
- Patent Title: Copolymer formulations, methods of manufacture thereof and articles comprising the same
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Application No.: US14580303Application Date: 2014-12-23
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Publication No.: US09828518B2Publication Date: 2017-11-28
- Inventor: Phillip D. Hustad , Peter Trefonas, III , Jong Keun Park
- Applicant: Dow Global Technologies LLC , ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Applicant Address: US MI Midland US MA Marlborough
- Assignee: DOW GLOBAL TECHNOLOGIES LLC,ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee: DOW GLOBAL TECHNOLOGIES LLC,ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee Address: US MI Midland US MA Marlborough
- Agency: Cantor Colburn LLP
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/308 ; H01L21/02 ; C09D133/08 ; C09D153/00 ; G03F7/00 ; H01L21/027
Abstract:
Disclosed herein is a method comprising disposing a mat composition on a surface of a semiconductor substrate; where the mat composition comprises a random copolymer comprising a first acrylate unit and a second unit; where the copolymer does not comprise a polystyrene or a polyepoxide; crosslinking the random copolymer; disposing a brush backfill composition on the substrate; such that the brush backfill composition and the mat composition alternate with each other; disposing on the brush backfill composition and on the mat composition a block copolymer that undergoes self assembly; and etching the block copolymer to create uniformly spaced channels in the semiconductor substrate.
Public/Granted literature
- US20150184017A1 COPOLYMER FORMULATIONS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME Public/Granted day:2015-07-02
Information query
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