- 专利标题: Thermal processing apparatus and thermal processing method for heating substrate by light irradiation
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申请号: US14081013申请日: 2013-11-15
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公开(公告)号: US09831108B2公开(公告)日: 2017-11-28
- 发明人: Kenichi Yokouchi , Nobuhiko Nishide
- 申请人: DAINIPPON SCREEN MFG. CO., LTD.
- 申请人地址: JP Kyoto
- 专利权人: SCREEN Holdings Co., Ltd.
- 当前专利权人: SCREEN Holdings Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Ostrolenk Faber LLP
- 优先权: JP2012-271573 20121212
- 主分类号: H01L21/67
- IPC分类号: H01L21/67
摘要:
A susceptor that holds a semiconductor wafer placed thereon is capable of moving up and down inside a chamber. For preheating with a halogen lamp, the susceptor moves to a preheating position. The preheating position is a height of the susceptor that achieves the most uniform in-plane illumination distribution of light emitted from the halogen lamp and applied to the semiconductor wafer. After the preheating is finished, the susceptor moves to a flash heating position for irradiation with a flash from a flash lamp. The flash heating position is a height of the susceptor that achieves the most uniform in-plane illumination distribution of a flash emitted from the flash lamp and applied to the semiconductor wafer.
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