Invention Grant
- Patent Title: Cover glass for light emitting diode package, sealed structure, and light emitting device
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Application No.: US15171051Application Date: 2016-06-02
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Publication No.: US09831392B2Publication Date: 2017-11-28
- Inventor: Makoto Shiratori , Yoko Mitsui , Satoshi Takeda
- Applicant: Asahi Glass Company, Limited
- Applicant Address: JP Chiyoda-ku
- Assignee: Asahi Glass Company, Limited
- Current Assignee: Asahi Glass Company, Limited
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-256170 20131211
- Main IPC: H01L33/48
- IPC: H01L33/48 ; C03C3/091 ; C03C3/093 ; C03C3/11 ; C03C8/24 ; H01L33/56 ; H01L33/32 ; H01L33/50

Abstract:
To provide a cover glass for light emitting diode package, which is capable of preventing deterioration in transmittance characteristics during use for a long period of time, and a light emitting device. The cover glass for light emitting diode package has a basic composition comprising, by mass % as calculated as oxides, from 55 to 80% of SiO2, from 0.5 to 15% of Al2O3, from 5 to 25% of B2O3, from 0 to 7% of Li2O, from 0 to 15% of Na2O, from 0 to 10% of K2O (provided Li2O+Na2O+K2O=from 2 to 20%), from 0 to 0.1% of SnO2 and from 0.001 to 0.1% of Fe2O3, it does not substantially contain As2O3, Sb2O3 and PbO, and it has an average thermal expansion coefficient of from 45 to 70×10−7/° C. in a temperature range of from 0 to 300° C.
Public/Granted literature
- US20160276544A1 COVER GLASS FOR LIGHT EMITTING DIODE PACKAGE, SEALED STRUCTURE, AND LIGHT EMITTING DEVICE Public/Granted day:2016-09-22
Information query
IPC分类: