Cover glass for light emitting diode package, sealed structure, and light emitting device
Abstract:
To provide a cover glass for light emitting diode package, which is capable of preventing deterioration in transmittance characteristics during use for a long period of time, and a light emitting device. The cover glass for light emitting diode package has a basic composition comprising, by mass % as calculated as oxides, from 55 to 80% of SiO2, from 0.5 to 15% of Al2O3, from 5 to 25% of B2O3, from 0 to 7% of Li2O, from 0 to 15% of Na2O, from 0 to 10% of K2O (provided Li2O+Na2O+K2O=from 2 to 20%), from 0 to 0.1% of SnO2 and from 0.001 to 0.1% of Fe2O3, it does not substantially contain As2O3, Sb2O3 and PbO, and it has an average thermal expansion coefficient of from 45 to 70×10−7/° C. in a temperature range of from 0 to 300° C.
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