Invention Grant
- Patent Title: Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors
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Application No.: US14861648Application Date: 2015-09-22
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Publication No.: US09841341B2Publication Date: 2017-12-12
- Inventor: Fulvio Vittorio Fontana , Jefferson Talledo
- Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS, INC.
- Applicant Address: IT Agrate Brianza PH Calamba
- Assignee: STMICROELECTRONICS S.R.L.,STMICROELECTRONICS, INC.
- Current Assignee: STMICROELECTRONICS S.R.L.,STMICROELECTRONICS, INC.
- Current Assignee Address: IT Agrate Brianza PH Calamba
- Agency: Seed Intellectual Property Law Group LLP
- Priority: ITTO2014A0977 20141126
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/498 ; G01L19/14 ; B81B7/00 ; B81C1/00 ; H01L23/057 ; H01L23/495
Abstract:
A surface mounting device has one body of semiconductor material such as an ASIC, and a package surrounding the body. The package has a base region carrying the body, a cap and contact terminals. The base region has a Young's modulus lower than 5 MPa. For forming the device, the body is attached to a supporting frame including contact terminals and a die pad, separated by cavities; bonding wires are soldered to the body and to the contact terminals; an elastic material is molded so as to surround at least in part lateral sides of the body, fill the cavities of the supporting frame and cover the ends of the bonding wires on the contact terminals; and a cap is fixed to the base region. The die pad is then etched away.
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