Invention Grant
- Patent Title: Heat spreading substrate with embedded interconnects
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Application No.: US14600595Application Date: 2015-01-20
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Publication No.: US09842745B2Publication Date: 2017-12-12
- Inventor: Ilyas Mohammed , Masud Beroz
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/14 ; H01L23/00 ; H01L21/52 ; H01L21/768 ; H01L23/495
Abstract:
Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside the metal parallelepiped. The plurality of wires have a different grain structure than the metal parallelepiped. The plurality of wires are electrically isolated from the metal parallelepiped. The plurality of wires may be electrically isolated from one another.
Public/Granted literature
- US20150132894A1 Heat spreading substrate with embedded interconnects Public/Granted day:2015-05-14
Information query
IPC分类:
