Invention Grant
- Patent Title: Method of manufacturing multi-layer thin film, member including the same and electronic product including the same
-
Application No.: US14291652Application Date: 2014-05-30
-
Publication No.: US09845535B2Publication Date: 2017-12-19
- Inventor: Jin Sub Kim , Hyong Jun Yoo , Min Chul Jung , Hyun Jun Jung , Jin Hyun Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2013-0062484 20130531; KR10-2013-0078132 20130704; KR10-2013-0131649 20131031
- Main IPC: B05D1/04
- IPC: B05D1/04 ; B05D1/38 ; B32B15/082 ; C23C28/00 ; C23C14/00 ; C23C14/34 ; C23C30/00
Abstract:
Disclosed herein is a method of forming a multilayer thin film by depositing target particles, detached from a target by plasma discharge of inert gas, on a metal object using a multilayer thin film deposition apparatus and a multilayer thin film formed by the method. More specifically, a sputtering deposition apparatus is used as the multilayer thin film deposition apparatus. The method includes coating a metal object with a coating layer, depositing at least one hardness-enhancing layer on the coating layer, and depositing a color layer on the at least one hardness-enhancing layer.
Public/Granted literature
Information query
