Invention Grant
- Patent Title: Semiconductor devices and methods of manufacturing the same
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Application No.: US14519516Application Date: 2014-10-21
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Publication No.: US09847224B2Publication Date: 2017-12-19
- Inventor: Dong-Hyuk Kim , Geo-Myung Shin , Dong-Suk Shin
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0012039 20140203
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L29/16 ; H01L21/02 ; H01L21/8238 ; H01L21/8234 ; H01L27/092 ; H01L29/165 ; H01L21/84 ; H01L29/66 ; H01L29/78 ; H01L27/12 ; H01L27/11

Abstract:
A semiconductor device includes: a substrate including a plurality of first active regions and a plurality of second active regions; a plurality of first gate structures formed above the first active regions, respectively, and a plurality of second gate structures formed above the second active regions, respectively; and a plurality of first source/drain layers corresponding to the first gate structures, respectively, and a plurality of second source/drain layers corresponding to the second gate structures, respectively, wherein a width of each of the first source/drain layers is smaller than a width of each of the second source/drain layers.
Public/Granted literature
- US20150221654A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2015-08-06
Information query
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