Invention Grant
- Patent Title: Magnetic intermetallic compound interconnect
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Application No.: US14566185Application Date: 2014-12-10
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Publication No.: US09847308B2Publication Date: 2017-12-19
- Inventor: Rajasekaran Swaminathan , Ravindranath V. Mahajan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Green, Howard & Mughal LLP.
- Agent Robert G. Winkle
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H05K3/34
Abstract:
The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.
Public/Granted literature
- US20160379951A9 MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT Public/Granted day:2016-12-29
Information query
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