Invention Grant
- Patent Title: Multilayered polyimide film having a low dielectric constant, laminate structure including the same and manufacture thereof
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Application No.: US14561070Application Date: 2014-12-04
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Publication No.: US09850401B2Publication Date: 2017-12-26
- Inventor: Chung-Ting Lai , Chih-Wei Lin
- Applicant: TAIMIDE TECHNOLOGY INCORPORATION
- Applicant Address: TW Hsinchu County
- Assignee: Taimide Technology Incorporation
- Current Assignee: Taimide Technology Incorporation
- Current Assignee Address: TW Hsinchu County
- Agency: Baker & McKenzie LLP
- Priority: TW102144607 20131205
- Main IPC: C09D179/08
- IPC: C09D179/08 ; B32B27/08 ; B32B27/20 ; B32B27/28 ; B32B27/32 ; H05K1/03 ; H05K3/38 ; C08G73/10 ; B32B38/00 ; H05K3/02

Abstract:
A multilayered polyimide film includes a first polyimide layer containing fluorine-containing polymer particles and having a first surface and a second surface, and a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface. The second and the third polyimide layers contain organic silicon oxygen compound particles. The multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.
Public/Granted literature
Information query
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