Invention Grant
- Patent Title: Data folding in 3D nonvolatile memory
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Application No.: US14923137Application Date: 2015-10-26
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Publication No.: US09858009B2Publication Date: 2018-01-02
- Inventor: Abhijeet Bhalerao , Mrinal Kochar , Dennis S. Ea , Mikhail Palityka , Aaron Lee , Yew Yin Ng , Ivan Baran
- Applicant: SanDisk Technologies LLC
- Applicant Address: US TX Plano
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Plano
- Agency: Foley & Lardner LLP
- Main IPC: G06F3/06
- IPC: G06F3/06

Abstract:
Data that is initially stored in Single Level Cell (SLC) blocks is subsequently copied (folded) to a Multi Level Cell (MLC) block where the data is stored in MLC format, the data copied in a minimum unit of a fold-set, the MLC block including a plurality of separately-selectable sets of NAND strings, data of an individual fold-set copied exclusively to two or more word lines of an individual separately-selectable set of NAND strings in the MLC block.
Public/Granted literature
- US20170115884A1 Data Folding in 3D Nonvolatile Memory Public/Granted day:2017-04-27
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